2004
Authors
Moreira, PJ; Marques, PVS; Leite, AP;
Publication
Integrated Optics and Photonic Integrated Circuits
Abstract
2004
Authors
Soppera, O; Moreira, PJ; Marques, PVS; Leite, AP;
Publication
Integrated Optics and Photonic Integrated Circuits
Abstract
2011
Authors
Dolgaleva, K; Malacarne, A; Tannouri, P; Fernandes, LA; Grenier, JR; Aitchison, JS; Azana, J; Morandotti, R; Herman, PR; Marques, PVS;
Publication
2011 Conference on Lasers and Electro-Optics: Laser Science to Photonic Applications, CLEO 2011
Abstract
We experimentally realized an integrated temporal Fourier transformer based on a linearly-chirped Bragg grating waveguide written in silica glass with a femtosecond laser. The device operates in reflection and has a 10-nm bandwidth. © 2011 OSA.
2011
Authors
Viegas, J; Mayeh, M; Marques, P; Farahi, F;
Publication
2011 Conference on Lasers and Electro-Optics: Laser Science to Photonic Applications, CLEO 2011
Abstract
An integrated optical refractometer based on multimode interference, with sensitivity enhancement due to sub-micrometer axial features, is demonstrated with experimental sensitivity as high as 3200 nm/RIU and resolution limits on the order of 5 ppm. © 2011 OSA.
1998
Authors
McLaughlin, AJ; Bonar, JR; Jubber, MG; Marques, PVS; Hicks, SE; Wilkinson, CDW; Aitchison, JS;
Publication
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
Abstract
We report on the use of CHF3, C2F6, and SF6 as etch gases for deep reactive ion etch processing of germano-boro-silicate glass films prepared by flame hydrolysis deposition (FHD). The glass film under study had a composition of 83 wt % SiO2, 12 wt % GeO2, and 5 wt % B2O3. The scope of the study was to identify the benefits and drawbacks of each gas for fabrication of deep structures (>10 mu m) and to develop an etch process in each peas system. The etch rate, etch profile, and surface roughness of the FHD glass films were investigated for each gas. Etch rates and surface roughness were measured using a surface profiler and etch profiles were assessed using a scanning electron microscope. It was found that SF6 had the highest FHD glass etch rate and nichrome mask selectivity (>100:1) however, it had the lowest photoresist mask selectivity (<1:2) and highest lateral erosion. CHF3 had the lowest FHD glass etch rate but high selectivity over both nichrome (>80:1) and photoresist (>10:1) and the etch profile was found to be smooth and vertical. C2F6 had a similar etch profile to that of CHF3, but the selectivity over both mask materials was lower than in CHF3. Fused silica was used as a reference material where it was found the percentage drop in etch rate in C2F6, SF6, and CHF3 was -12%, -15%, and -37%, respectively. From the results presented here CHF3 proved to be the most versatile etch process as either photoresist or nichrome masks could be used to attain depths of 20 mu m, or more. (C) 1998 American Vacuum Society.
1998
Authors
Bonar, JR; Vermelho, MVD; Marques, PVS; McLaughlin, AJ; Aitchison, JS;
Publication
OPTICS COMMUNICATIONS
Abstract
Fluorescence lifetimes and scatter losses for Er3+ doped, silica waveguides formed by aerosol doping and flame hydrolysis deposition are reported. The fast decay component and out of plane scatter decreased markedly with optimisation of the deposition technique, sintering process and co-doping regime. (C) 1998 Elsevier Science B.V.
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