Mobile Robotic
Work description
- Assembly of omnidirectional mobile platforms, based on bent sheet metal and 3D printed parts, based on the Hangfa Discovery Q2 platform - Validation and assembly of the electronic component (drive units, microcontrollers, drivers, batteries, BMSs) - Firmware validation on omnidirectional mobile platforms - Design of supports for perception sensors (minimum: 2D laser scanners) to be coupled to omnidirectional mobile platforms - Integration of INESC TEC's navigation stack for industrial mobile robots on omnidirectional platforms - Demonstration of omnidirectional mobile platforms developed at the iilab facilities - Industry and Innovation Laboratory
Academic Qualifications
The candidate must be enrolled in an undergraduate and/or master's degree in electrical engineering, computer science or similar;
Minimum profile required
- The candidate must be enrolled in an undergraduate and/or master's degree in electrical engineering, computer science or similar;- Experience in hardware development;- Experience in C/C++ programming;
Preference factors
- Previous experience in designing parts for 3D printing - Participation in extra-curricular activities linked to robotics is valued
Application Period
Since 25 Jul 2024 to 07 Aug 2024
Centre
Robotics in Industry and Intelligent Systems